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Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Featured Image
  • Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures

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As a result of ours specialty and service consciousness, our company has won a good reputation among customers all over the world for Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Florence, Rotterdam, Hyderabad, Our company mission is that providing high quality and beautiful products with reasonable price and strive to gain 100% good reputation from our clients. We believe Profession achieves excellence! We welcome you to cooperate with us and grow up together.
    • The company has rich resources, advanced machinery, experienced workers and excellent services, hope you keep improving and perfecting your products and service, wish you better!
    5 Stars By Maggie from Somalia - 2017.10.25 15:53
    This supplier stick to the principle of "Quality first, Honesty as base", it is absolutely to be trust.
    5 Stars By Elma from Paris - 2018.06.26 19:27
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