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Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Featured Image
  • Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures

Related Product Guide:
We continue to keep increasing and perfecting our solutions and service. At the same time, we operate actively to do research and enhancement for Well-designed Vlp-2 Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Roman, New Zealand, Tanzania, With the technology as the core, develop and produce high-quality products according to the diverse needs of the market. With this concept,the company will continue to develop products with high added values and continuously improve products,and will provide many customers with the best products and services!
    • The supplier abide the theory of "quality the basic, trust the first and management the advanced" so that they can ensure a reliable product quality and stable customers.
    5 Stars By Camille from Jordan - 2017.06.25 12:48
    We are a small company that has just started, but we get the company leader's attention and gave us a lot of help. Hope we can make progress together!
    5 Stars By Hilary from Melbourne - 2017.01.28 18:53
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