Wholesale Discount Copper Foil For Printed Circuit Board - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM


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Wholesale Discount Copper Foil For Printed Circuit Board - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM Detail:

JIMA Copper proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.

Detail

● Thickness: 12um 18um 35um
● Standard Width: 1290mm, can be cutting as size request.
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-20days
● High precision cutting equipment cut copper foils according to width required by customers.
● Slitting Working Procedure: Conduct slitting, classification, inspection and package according to requirement for quality, width and weight of copper foils of customers.

Features

● Ultra -low profile, with high peel
● Strength and good etchability
● Low coarsening technology

Application

● High speed digital
● Base station/server
● PPO/PPE
● Use Low coarsening technology ,the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● High frequency transmission circuit / High Speed Transmission.

Typical Properties of Hyper Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Matte side(Rz)

um

1.5-2.0

optical method

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

40

 

Standard Width,1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


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Wholesale Discount Copper Foil For Printed Circuit Board - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM detail pictures


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All we do is often involved with our tenet " Purchaser to start with, Rely on initially, devoting over the food stuff packaging and environmental defense for Wholesale Discount Copper Foil For Printed Circuit Board - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM , The product will supply to all over the world, such as: Greece, Rotterdam, Saudi Arabia, We'll initiate the second phase of our development strategy. Our company regards "reasonable prices, efficient production time and good after-sales service" as our tenet. If you are interested in any of our products and solutions or would like to discuss a custom order, make sure you feel free to contact us. We've been looking forward to forming successful business relationships with new clients around the world in the near future.
  • The product manager is a very hot and professional person, we have a pleasant conversation, and finally we reached a consensus agreement.
    5 Stars By Charlotte from Sacramento - 2017.05.31 13:26
    Product quality is good, quality assurance system is complete, every link can inquire and solve the problem timely!
    5 Stars By Debby from Rome - 2018.06.26 19:27
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